Whitepapers

Ultra Low Thermal Resistance Adhesives for Electronic Applications

Executive Summary

As advances in epoxies and silicones evolve, manufacturers of advanced electronic systems find that adhesives provide many options for thermal, environmental, and structural stability. With greater challenges in assembling die, package, and other components into products able to cope with increasing heat loads, adhesives are uniquely qualified to meet these requirements. Download this white paper on how ultra low thermally resistance adhesives are so effective in handling thermal management.

Presented By:

Companies associated with Physics Today offer a series of whitepapers/archived webinars to download and offer an opportunity to converse with the sponsor if you provide your name, company, and email address to receive further marketing information.